{"id":3799,"date":"2007-10-10T08:43:29","date_gmt":"2007-10-10T15:43:29","guid":{"rendered":"http:\/\/www.dfcint.com\/dossier\/?post_type=news&#038;p=3799"},"modified":"2013-03-03T18:57:44","modified_gmt":"2013-03-04T02:57:44","slug":"360-component-upgrade","status":"publish","type":"post","link":"https:\/\/www.dfcint.com\/dossier\/360-component-upgrade\/","title":{"rendered":"360 Component Upgrade"},"content":{"rendered":"<div id=\"attachment_5318\" style=\"width: 385px\" class=\"wp-caption alignleft\"><img aria-describedby=\"caption-attachment-5318\" loading=\"lazy\" class=\"size-full wp-image-5318\" alt=\"An Xbox 360 with its case open.\" src=\"http:\/\/www.dfcint.com\/dossier\/wp-content\/uploads\/2007\/10\/360-Open-S.jpg\" width=\"375\" height=\"250\" \/><p id=\"caption-attachment-5318\" class=\"wp-caption-text\">An Xbox 360 with its case open.<\/p><\/div>\n<p>OCT. 9, 2007 \u2022 The <i>San Jose Mercury News<\/i> reports that production Xbox 360s will not receive another motherboard upgrade until the third quarter of 2008. At the time, a more efficient graphics chip from ATI, plus smaller memory chips, will be used. The changes are expected to further reduce heat issues, plus lower the production cost of the console.<\/p>\n<p><span style=\"color: #3366ff;\"><em>Impact: Given the heat problems generated by the original Xbox 360 design, and the multi-stage approach Microsoft took to fixing the problem, consumers have been left unsure of exactly what to expect from their purchases. Such scenarios often lead well-informed consumers to put off their purchases until the latest hardware update arrives. With a year of architecture consistency, those concerns evaporate.<\/em><\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>OCT. 9, 2007 \u2022 The San Jose Mercury News reports that production Xbox 360s will not receive another motherboard upgrade until the third quarter of 2008. At the time, a more efficient graphics chip from ATI, plus smaller memory chips, will be used. The changes are expected to further reduce heat issues, plus lower the [&hellip;]<\/p>\n","protected":false},"author":9,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[],"tags":[],"_links":{"self":[{"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/posts\/3799"}],"collection":[{"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/comments?post=3799"}],"version-history":[{"count":3,"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/posts\/3799\/revisions"}],"predecessor-version":[{"id":5317,"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/posts\/3799\/revisions\/5317"}],"wp:attachment":[{"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/media?parent=3799"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/categories?post=3799"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.dfcint.com\/dossier\/wp-json\/wp\/v2\/tags?post=3799"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}